May 14, 2025
Wire-to-wire: TSVs may be the key to faster semiconductors
As computer processors get smaller and more powerful, semiconductor engineers are running into the physical limits of how fast these chips can operate. One strategy involves stacking chips in 3D and using tiny wires called TSVs (through silicon vias) as vertical connectors. Purdue University researchers are zeroing in on the study of TSVs — how small they can be made while still robust enough to be reliable.